Specifications

 
XID 8100 Technical specifications
Print Method:             Dye sublimation retransfer
Print Mode:          Single- or double-sided(optional) overthe- edge retransfer printing(full bleed)
Print Speed:              Up to 102 cards per hour (single-sided)
Print Resolution:         300 dpi
Printhead:                Lifetime warranty (using EDIsecure materials)
Card Types:               PVC, Composite PVC, ABS, PET, and Polycarbonate Cards of
                          ISO ID-1/CR-80 size, 85.60 x 53.98 mm
Card Thickness:           0.25 – 1.02 mm (hopper adjustment required)
Input Hopper Capacity:    200 cards (0.76 mm)
Output Hopper Capacity:   100 cards (0.76 mm)
Interface:                  USB 2.0 and Ethernet
Operating System Support: Windows 2000/XP/7/Vista
Printer Dimensions:        343×322×360 mm（(WxDxH）
Weight:                   13.9 kg(excluding optional built-in items)
Power Supply:          100/120 V and 220/240 V, 50/60Hz FCC, CE, UL, GOST-R, and CCC approved
Operating Environment:    15°C to 30°C, 35% to 70% non-condensing humidity
Supplies:                  4 Panel Color Ribbon (YMCK): 1,000 cards/ribbon
                          5 Panel Color Ribbon (YMCKK): 750 cards/ribbon
                          5 Panel Peel-Off Ribbon (YMCK-PO): 750 cards/ribbon
                          5 Panel UV Ribbon (YMCK-UV): 750 cards/ribbon
                          XID Retransfer Film: 1,000 cards/film
 
 
Options:                  Bend remedy station
                          Magnetic stripe encoding (HiCo and LoCo)
                          Contact chip encoding
                          Contactless chip encoding(Mifare, DESFire, HID iCLASS, Legic, etc.)
                          A variety of chip encoder plug-ins for Advanced CEF
                          Inline lamination (single-and double-sided, ILM-DS)